News Releases

MACOM's MATA-07825 is a low power, high-sensitivity TIA New TIA enables 12G-SDI with support for pathological patterns MACOM's TIA solutions to be showcased at NAB 2018, Booth #N3908 LOWELL, Mass. --(BUSINESS WIRE)-- MACOM Technology Solutions Inc. ("MACOM"), a leading supplier of semiconductor

LOWELL, Mass. --(BUSINESS WIRE)-- MACOM Technology Solutions Holdings, Inc. (NASDAQ: MTSI) ("MACOM"), a leading supplier of high-performance RF, microwave, millimeterwave and lightwave semiconductor products, today announced it will release second quarter fiscal year 2018 financial results on

Leader Electronics' LV5600 2 nd Generation 4K waveform monitor will use MACOM's 12G-SDI chipset MACOM's 12G-SDI Equalizer, Reclocker and Crosspoint Switch to enable higher accuracy and quality MACOM's 12G-SDI solutions will showcase at NAB 2018, Booth #N3908 LOWELL, Mass.

MACOM's MARC-23285, MAXP-23002 and MAXP-23004 reclockers enable 4K broadcast video applications Single, Dual and Quad channel reclockers feature fully adaptive equalization front end MACOM's 12G-SDI reclocker family will showcase at NAB 2018, Booth #N3908 LOWELL, Mass.

Showcasing Award-Winning Product Portfolio Enabling High Data-Rate Video Transport Demos Include a New Low Power 12G-SDI Reclocker Family and Semiconductor Solutions for 12G-SDI Over Optical Fiber Visit Booth #N3908 at NAB in Las Vegas , April 9 - 12 LOWELL, Mass.

MACOM's new MAOM-005311 and MAOM-005411 are single- and quad-channel 53Gbaud EML drivers with 1.8Vpp output Devices feature very low power and high bandwidth required to support 100G per lambda modules Small form-factor surface-mount packaging to enable 100G and 400G DR and FR modules LOWELL, Mass.

Leverages 53Gbaud PAM4 technology with MACOM's PRISM™ and SystemOnGlass™ technology from ColorChip Solution to deliver requisite cost to enable mainstream 100G Single-Lambda PAM-4 deployment 100G Single-Lambda QSFP28 Solution to demo at OFC 2018 at ColorChip Booth #2529 LOWELL, Mass.

MACOM's new MAOM-006408 features high bandwidth, excellent linearity and low power consumption Device performance offers full analog and digital control for meeting the requirements for both HB-CDM and IC-TROSA standards for 600G deployments. Single die solution enabling 64Gbaud and 64 QAM

Silicon Photonics platform enables CWDM4, DR1 and FR4 L-PICs with optimal performance and cost-effectiveness to scale Cloud Data Center and 5G Telecom deployment Automated self-aligning laser to PIC technology to enable breakthrough manufacturing throughput, capacity and cost structure

MACOM's MATA-03003/3006 TIA solutions with integrated PIN and APD are ideal for next generation 5G wireless, enterprise and storage networks 2 nd Generation TIAs feature low power, high sensitivity/overload and optical sub-assembly flexibility for lower system cost TIA solutions to be showcased at